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Program Committee

Rui Abreu, Universidade de Lisboa, Portugal

Emil Alegroth, Blekinge Institute of Technology, Sweden

Nadia Alshahwan, JP Morgan Chase, United Kingdom

Anneliese Andrews, University of Denver, United States

Benoit Baudry, KTH Royal Institute of Technology, Sweden

Jonathan Bell, George Mason University, United States

Cristiano Bertolini, Center of Informatics, Federal University of Pernambuco (CIn-UFPE), Brazil

Fabrice Bouquet, University of Franche-Comte, France

Renee Bryce, University of North Texas, United States

Cristian Cadar, Imperial College London, United Kingdom

Jeffrey Carver, University of Alabama, United States

T.Y. Chen, Swinburne University of Technology, Australia

Eun-Hye Choi, National Institute of Advanced Industrial Science and Technology (AIST), Japan

James Clause, University of Delaware, United States

Christoph Csallner, University of Texas at Arlington, United States

Xavier Devroey, Delft University of Technology, The Netherlands

Massimiliano Di Penta, University of Sannio, Italy

Hyunsook Do, University of North Texas, United States

Wensheng Dou, Institute of Software, Chinese Academy of Sciences

Sigrid Eldh, Ericsson AB, Sweden

João Pascoal Faria, FEUP, INESC TEC, Portugal

Gregory Gay, University of South Carolina, United States

Jaco Gedlenhuys, Stellenbosch University, South Africa

Milos Gligoric, The University of Texas at Austin, United States

Mark Grechanik, University of Illinois at Chicago, United States

William G.J. Halfond, University of Southern California, United States

Dan Hao, Peking University, China

Rob Hierons, Brunel University, United Kingdom

Hadi Hemamati, University of Calgary, Canada

Shin Hong, Handong Global University, Republic of Korea

Rick Kuhn, National Institute of Standards & Technology, United States

Gregory Kapfhammer, Allegheny College, United States

Sarfraz Khurshid, The University of Texas at Austin, United States

Fitsum Meshesha Kifetew, Fondazione Bruno Kessler, Italy

Yunho Kim, Korea Advanced Institute of Science and Technology, Republic of Korea

Yves Le Traon, University of Luxembourg, Luxembourg

Yu Lei, University of Texas at Arlington, United States

Xuandong Li, Nanjing University, China

Patricia Machado, Federal University of Campina Grande, Brazil

Sonal Mahajan, University of Southern California, United States

Eda Marchetti, ISTI-CNR, Italy

Dusica Marijan, Simula Research, Norway

Darko Marinov, University of Illinois at Urbana-Champaign, United States

Wes Masri, American University of Beirut, Lebanon

Phil McMinn, The University of Sheffield, United Kingdom

Ali Mesbah, The University of British Columbia, Canada

Brian Nielsen, Aalborg University, Denmark

Mike Papadakis, University of Luxembourg, Luxembourg

Adam Porter, University of Maryland, United States

Alexander Pretschner, Technical University of Munich, Germany

Xiao Qu, ABB Corporate Research, United States

Abhik Roychoudhury, National University of Singapore, Singapore

Sreedevi Sampath, University of Maryland, Baltimore County, United States

Itai Segall, Bell Labs Israel, Israel

Sara Sprenkle, Washington and Lee University, United States

Alin Stefanescu, University of Bucharest, Romania

Paul Strooper, The University of Queensland, Australia

Paolo Tonella, Fondazione Bruno Kessler, Italy

T.H. Tse, The University of Hong Kong, Hong Kong

Rachel Tzoref Brill, IBM Research - Haifa, Israel

Tanja Vos, Open Universiteit and Universitat Politecnica de Valencia, Spain

Neil Walkinshaw, The University of Leicester, United Kingdom

Helene Waselynck, LAAS-CNRS, France

Jun Wei, Institue of Software, Chinese Academy of Sciences, China

Guowei Yang, Texas State University, United States

Hiroaki Yoshida, Fujitsu Laboratories of America, Inc., United States

Tingting Yu, University of Kentucky, United States

Razieh Nokhbeh Zaeem, The University of Texas at Austin, United States

Fadi Zaraket, American University of Beirut, Lebanon

Andreas Zeller, Saarland University, Germany

Lingming Zhang, The University of Texas at Dallas, United States




Team

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